Packaging R&D Engineer

Packaging R&D Engineer Job Description - Microelectronic Packaging R&D Engineer focuses on researching and developing of new electronic packaging technology during the product development cycle.
- Responsible for the thermal/mechanical/fluid design, analysis, and development of electronic package and system which leverage computer aided engineering (CAE), specialized metrologies and lab scale experimental techniques.
- The scope maonducting product risk assessment using modeling and simulation, characterization of electronic package structural, fluids and thermal integrity to defining allowable dimensional tolerance to meet assembly quality requirements.
- This job also requires strong collaboration and analytical mindset to address convoluted technology challenges in R&D and high volume manufacturing environment.

Qualifications

- Master/PhD degree in Mechanical Engineering
- Familiar in either Finite Element Analysis (FEA) and Computational Fluid Dynamic (CFD).
- Experience in conducting lab experiment, dimensional measurement and basic knowledge about engineering programming software (eg: MATLAB/Python/C)

Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth