Packing Development Engineer

CANDIDATE RESPONSIBILITIES
Scopeofdailytasks,projectassignments,majorchallenges,keystakeholdersetc.
- Develop and characterize Packing material and Package Reflow process.
- Responsible to ensure technical communication and information flow within the project team and guiding technical discussions on
packing and reflow topics.
- Technical input for assembly process / equipment solutions for assigned new products or platform
- Define reel qty, packing material design and label specifications per requirement for new releases.
- Provide technical support on packing and reflow topics to establish robust package firewalls.

JOB REQUIREMENTS
Information on required education&experience level, knowledgeof specific tools and soft skills
- Hands-on ASM andIsmecahandlers.
- Degree/Masters in Engineering (Mechanical/Applied Science).
- Minimum 5 years related semiconductor assembly or development (R&D) experience.
- Strong knowledge in Material and process interactions, FMEA, SPC, DoE & troubleshooting skills, .
- Mentally strong, resourceful with good communication skill with people at all levels.
- Good knowledge of industrial standards and practices.
- Good network of equipment and BoM suppliers.
- Able to manage stress during Covid pandemic.

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Nexperia is an EqualOpportunity/AffirmativeAction Employer.