As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry-standard design packages.About the Role:We are looking for a highly motivated and proactive semiconductor 3D IC flow and design engineer with strong PDN, SI/PI and EMIR design experiences.Responsibilities may include, but are not limited to:- Participate in 3D IC reference design flow development using Intel advanced 3D IC packaging processes to strategically promote Intel technologies to customers.- Participate in development of 3DIC PDN architecture and validation flows using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.- Focus on SI/PI signoff flow using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.- Participate in lab evaluation for prototype 3D IC reference design.- Cross-functional interface with IC design, CAD/DAE, thermal and system/product teams.- Evaluate Intel foundry packaging technologies and propose areas of improvement to ensure Intel competitive edge; support internal and external customers to facilitate Intel technology enablement and customer solution development.**Qualifications**:Minimum Requirements:- Bachelor of Science in Electrical Engineering or related fields.- Knowledge in advanced package and design.- Experience on 2DIC and 3DIC PDN Design and Architecture.- Experiences in 2D simulation tools for extracting package layout models for power integrity and signal integrity (PI and SI) analysis.- Experiences with PI and SI simulation flow and methodology.- Excellent interpersonal, analytical, written, and verbal communication skills; strong team player.Preferred Experiences in one or more items below:- Experiences in high-speed package or board design and layout.- Experiences with Intel Foveros and EMIB technologies.- Experiences in 3D simulation tools for extracting package layout models for power integrity and signal integrity (PI and SI) analysis.- Experiences with advanced chiplet design with multiple dies such as HBM's, GPU's and CPU's.- Experiences with 2D, 2.5D and/or 3D packaging integration design.- Familiar with various packaging technologies such as BGA, fcCSP, WLCSP, system-in-package SiP, multi-chip modules MCM, wire-bond, heterogenous integration, AiP, AoP, SoC Solder ball, Cu pillar, hybrid, thermocompression, and bonding techniques.- Familiar with packaging knowledge that includes SMT, flip chip, bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach.- OSAT or foundry 2.5D or 3D packaging design experience.- Experiences with thermal analysis and thermal measurement at die and package levels.**Inside this Business Group**:Intel Foundry Services (IFS) is an independent foundry business that is established to meet our customers' unique product needs. With the first "Open System Foundry" model in the world, our combined offerings of wafer fabrication, advanced process, and packaging technology, chiplet, software, robust ecosystem, and assembly and test capabilities help our customers build their innovative silicon designs and deliver full end-to-end customizable products from Intel's secure, resilient and sustainable source of supply.**Posting Statement**:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.**Benefits**:We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.**Working Model**:This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. **In certain circumstances the work model may change to a
