Manager, Product Development Engineering

About the Company: Our client is located in Penang, Malaysia, and is one of the state-of-the-art Assembly and Test service providers for high-performance computing and communication solutions. As one of the pioneer companies in Penang, their mission is to enable their global customers' success with leading-edge and differentiated high-value packaging solutions.
Job Responsibilities: To lead a team of product development engineers to develop and establish assembly processes recipe for new products through process characterization and process parameters optimization. Drive NPI to have APQP standard of handling over to HVM in meeting all KPI & Yield. Drive cost saving and process Cost of Ownership (COO) improvement through material selection, process cycle time improvement, productivity improvement/innovation. Drive Yield & Quality KPI improvement through Lean Six Sigma approach. Program Management of new products' introduction. Sense of ownership & responsibility. Capable high-level reporting. Other duties assigned by supervisor. Job Requirements: Education: Degree in Engineering (Material/Mechanical/Electrical/Electronic)/Applied Science(Physics).
Language: English (Written & Spoken).
Experience: Knowledge of Process Control, SPC, DOE, QC Tools, FMEA, Problem Analysis. Knowledge of Flip Chip PGA/BGA processes. Experience on creating recipe for Die Attach, Reflow oven, solder printing and chip attach will be an added advantage. Ability to perform temperature profile characterisation for new product introduction. Good knowledge on SMT line/ flip chip process control / SPC/ CPK or other advanced packing competency. Familiar with equipment for example Datacon die attach, Heller/ BTU reflow oven and Dek solder printing or any equivalent.
Remuneration: MYR 13,000 - MYR 17,000
Consultant in charge: Shin Yoong | |