Packaging Development Engineer (Flip Chip)

NXP SemiconductorsN.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has over 29,000 employees in more than 30 countries and posted revenue of $8.88 billion in 2019.

- Project leader responsible to lead a team in flip chip packaging development of advance technology node devices.
- Responsible also to own one or two flip chip processes from initial characterization work to package qualification stage including product safe launch in assembly.
- Process development requires hands-on work involving use of production equipment.
- Frequent use of analytical tool such as JMP to assist in the process characterization work.
- Cross functional interaction with operation team to ensure successful packaging qualification and transfer of the process to volume production.
- Candidate with strong project management and flip chip process experience is preferable.