Prin Engr, Package Development(Tl)

**KEY RESPONSIBILITIES**- This job requires a full-time senior engineer with strong engineering knowledge and skills in mold and trim and form equipment and process for early engagement in package development and qualification for a robust HVM.- Analyze and implement efficient, cost effective and innovative methodologies to improve assembly processes.- Good knowledge in Six Sigma methodology and the DMAIC approach.- Experienced in running the Design of Experiment (DOE) and analyzing data using JMP software.- Practice good quality system and production control.- Good teamwork and leadership.**KNOWLEDGE, SKILLS AND ABILITIES**- Must be statistically sound and familiar in running DOE, perform characterization and optimization studies independently. Familiar with JMP software is an advantage.- Proficient in Malay and English.**onsemi **(Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world's most complex challenges and leads the way in creating a safer, cleaner, and smarter world.More details about our company benefits can be found here:**QUALIFICATION AND EXPERIENCE**- Minimum Bachelor's Degree in Electronic, Electrical, Mechanical, material Engineering or equivalent.- Minimum of 5 years work experience as a mold/ trim and form engineer preferred.