Join Nexperia and connect your unique talents and passion to your goals for a fulfilling career with growth and reward. We are a global semiconductor manufacturer with a highly skilled and diverse workforce of over 15,000 employees from over 50 countries worldwide. Every electronic design in the world can be made complete with Nexperia products. To meet the customer's evolving needs, our engineers are dedicated to developing cutting-edge semiconductor solution via advanced design tools and methodologies to create innovative products that deliver high performance, reliability, efficiency, and quality.Nevertheless, we are also committed to provide a positive and supportive environment for our employees. We offer competitive compensation packages, health and wellness programs, on-the-job training, and career development opportunities. As well as promotes work-life balance by offering flexible work arrangements and various employee engagement initiatives.Together be part of something bigger, only at NexperiaAbout the role What you will doResponsible for the development, qualification and continuous improvement of various advanced inorganic BOM Material on discrete package and power module.Leadframe and substrate material development, material characterization and interaction with process.Leading cross-site technical competency team to synchronize with semiconductor industry direction and drive the and advanced material development.Identifies material cost down opportunities and drive projects to enhance package competitiveness.Daily works need apply statistical analysis tools, failure analysis and problem-solving techniques to enhance the material performance.What you will needMaster/Degree in Material Science / Mechanical / Applied Physics or related discipline with minimum 5 years experience in the Material field as a process manufacturing or development engineer in a semiconductor or other relevant.In-depth understanding of materials to understand its related process robustness and package integrity.Solid knowledge in Material selection and new Material qualification process.Solid leadership of cross-functional projects will be required to successfully solve complex BOM material and/or integration challenges.Knowledge on Semiconductor Packaging and Assembly preferredExcellent verbal and written communication skills in bilingual.A disciplined use of statistical methods (Minitab, DOE, Technical report writing, FMEA & etc.) is required.Experienced in dealing with China counterpart.Why work for us? At Nexperia, we offer comprehensive compensation and benefits package tailored to your individual needs, including:Competitive compensation and benefits: we offer competitive salaries, bonuses, and benefits packages to our employees, including health insurance, retirement plans, and paid time off.Career development opportunities: We provide various career development opportunities, including training programs, mentoring, and leadership development programs, to help employees enhance their skills and advance their careers.Work-life balance: We recognizes the importance of work-life balance and offers flexible work arrangements, including work-from-home options, to its employees in Malaysia.Employee engagement initiatives: We have various employee engagement initiatives, such as team-building activities, social events, and employee recognition programs, to promote a positive work culture and enhance employee morale.Health and wellness programs: We promote employee health and wellness through various on-site programs to help employees maintain a healthy work-life balance from the perspective of physical and mentality.Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.Nexperia is an Equal Opportunity/Affirmative Action Employer.
