Device Product Engineer

NXP SemiconductorsN.V. (NASDAQ: NXPI) enables secure connections for a smarter world, advancing solutions that make lives easier, better, and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the automotive, industrial & IoT, mobile, and communication infrastructure markets. Built on more than 60 years of combined experience and expertise, the company has approximately 29,000 employees in more than 30 countries and posted revenue of $8.61 billion in 2020.

1. Works with internal/external foundries to achieve technology benchmark wafer test yield and quality.
2. Drives wafer fab process defect reduction to improve yield and quality, drives Continuous Improvement Plan (CIP)
3. Interest in data analysis to correlate failure to test or process
4. Interest in semiconductor wafer fabrication processes.
5. Communicates and collaborates well with PE team and external teams.
6. Utilizes quality tools and automation to control variation - O+, EY, JMP, and internal fab tools

Qualification:
Bachelor in Electrical & Electronics Engineering, Physics or other relevance backgrounds.
Passion in data modelling and problem solving.
Good in collaboration and analytical skill.

Fresh Graduates are encouraged to apply.