Job DescriptionDelivers signal integrity solutions for large, complex highspeed platforms, boards, and packages. Develops a viable space for all interconnects including 2D and 3D models extracts of electrical structures for the entire die to die interconnect. Defines signal integrity rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins. Applies knowledge of signal integrity design and tradeoffs to perform simulations of interconnect and guide package and platform physical implementation, and designs and characterizes test structures to correlate simulations and measurements for interconnects using intricate highspeed equipment and debugs challenges. Develops electrical specifications and new industry standard interconnect specifications to guide consortiums for next generation interfaces. Documents and provides implementation guidelines to the end customers as part of the platform design guide. Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product landing zone requirements and minimize quality degradation (e.g., attenuation, crosstalk, jitter, power noise) and cost.QualificationsYou must possess a Bachelor, Master or PhD degree in Electrical/Electronics Engineering.Additional qualification includes but not limited to: - Strong technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply. - Experienced in using Electrical Design Analysis software tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice, Sigrity or any equivalent software will be added advantage. - Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor Expedition or any equivalent software will be added advantage. - Those with strong project management skills and the passion to continuously learn. - The applicant should also have excellent communication (written and presentation) and problem solving skills.- Excellent team work is an expectation.Inside this Business GroupAs the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth.Other LocationsMY, KulimPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.BenefitsWe offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Working ModelThis role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.
